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  Datasheet File OCR Text:
 SS22A THRU SS210A
SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
Reverse Voltage - 20 to 100 V Forward Current - 2 A Features * Metal silicon junction, majority carrier conduction * Low power loss, high efficiency * The plastic package carries Underwriters Laboratory flammability Classification 94V-0 * High forward surge current capability * Built-in strain relief, ideal for automated placement
Mechanical Data * Case: SMA (DO-214AC) molded plastic body * Terminals: Leads solderable per MIL-STD-750, Method 2026 * Polarity: Color band denotes cathode end * Mounting Position: Any
Maximum Ratings and Electrical Characteristics
Ratings at 25 OC ambient temperature unless otherwise specified. Single phase, half wave 60 Hz, resistive or inductive load, For capacitive load current derate by 20%.
Parameter Maximum Repetitive Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
Symbol SS22A SS23A SS24A SS25A SS26A SS28A SS210A Unit VRRM VRMS VDC I(AV) IFSM VF IR 20 CJ RJA TJ TS - 65 to + 125 220 75 - 65 to + 150 - 65 to + 150 0.55 20 14 20 30 21 30 40 28 40 50 35 50 2 50 0.75 0.5 mA 10 180
O
60 42 60
80 56 80
100 70 100
V V V A A
Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed on Rated Load (JEDEC method) Maximum Instantaneous Forward Voltage at 2 A Maximum DC Reverse Current at Rated TA = 25 OC DC Blocking Voltage Typical Junction Capacitance Typical Thermal Resistance
1)
0.85
V
TA = 100 OC
pF C/W
O
2)
Operating Junction Temperature Range Storage Temperature Range
1) 2)
C C
O
Measured at 1MHz and applied reverse voltage of 4 V DC. P.C.B mounted with 0.2 X 0.2" (5 X 5 mm) copper pad areas.
SEMTECH ELECTRONICS LTD.
(Subsidiary of Sino-Tech International Holdings Limited, a company listed on the Hong Kong Stock Exchange, Stock Code: 724)
(R)
Dated : 14/04/2008 C
SS22A THRU SS210A
SEMTECH ELECTRONICS LTD.
(Subsidiary of Sino-Tech International Holdings Limited, a company listed on the Hong Kong Stock Exchange, Stock Code: 724)
(R)
Dated : 14/04/2008 C


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